Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed the industry’s first 12-layer 3D-TSV

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Apple to supply parts to independent repair shops

Apple has just announced a new repair program, offering customers additional options for the most common out-of-warranty iPhone repairs. Apple

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How Are PCBs Being Used In New Tech Products?

PCBs have been around for many years and they are present in pretty much any piece of tech that you’ll

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